Technological Aspects of Applying Adhesives in Small Diameter Vias
نویسندگان
چکیده
One of the key problems for more efficient use of conventionally PCBs is plated through holes, because they consume a large fraction of PCB surface area. One of the solutions that can permit to save the PCB surface is using of blind and buried vias. Currently, many expensive plating and sequential lamination steps create the blind/buried vias. Electrically conductive adhesives are the materials, which can be used as hole fills in PCB manufacturing. The aim of the paper is to present how the adhesive viscosity, the way of adhesive printing and the way of preparing the hole can influence the efficiency of fill process as well as resistance of such prepared fills. The holes diameter 0.8, 0.5 and 0.3 mm (aspect ratio 1.25:1, 2:1 and 3.3:1), were used in experiments.
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